• Japanese

Surface Treatment Technologies

●Plating (Electrolytic and Electroless plating)

Plating (electrolytic and electroless plating) image

We are able to respond to a wide variety of needs with our plating technologies, such as Au plating for contact materials and contacts, environmentally-friendly lead-free solder plating, and electroless plating for ceramics and metals.

We have also established an Au plating technology to plate large quantities of fine Ni-P particles having large specific surface area, which has been deemed difficult. We therefore offer technologies that are essential to improve the performance and air tightness of electronic components.

【Applications】

  • ・Lead pins for MPU
  • ・Lead pins for electronic components
  • ・Insulating substrates
  • ・Printed circuit boards, etc.

Example of mass production

Base metals Kinds of plating materials / thickness
Materials Shapes Size
  • ・Pure Ni
  • ・Fe-Ni-Co alloy, Fe-Ni alloys
  • ・Cu, and Cu alloys
  • ・Stainless Steels
  • ・Al and Al alloys
Plate Under 0.06〜0.8t×10(Barrelplating)
Under 10×300(Rackplating)
  • ・Electrolytic Ni plating (2〜5μm)
  • ・Electrolytic Au plating (0.01〜0.5μm)
  • ・Electroless Au plating (5〜30nm)
Pin Φ0.3〜0.5 X1〜3L

Example of mass production

Comparison between our electroless plating and existing methods

Existing electroless Ni-P plating using Pd catalyst (Catalytic plating) our electroless plating (New method that prevents adsorption of Pd catalyst between patterns)

Comparison between NEOMAX Materials and existing electroless plating methods

Comparison between NEOMAX Materials and existing electroless plating methods

Comparison between NEOMAX Materials and existing electroless plating methods

* Pd catalyst is partially adsorbed between patterns, causing deposits.
* Our electroless plating with high reliability allows no deposits or short circuit between circuits.

【Materials】

  • ・Copper
  • ・Copper Alloys, etc.

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