［Heat-dispersion substrates and lead frames］
Clad metals for heat spreaders (Cu/36Ni-Fe/Cu, etc.)
Thermal conductivity and thermal expansion coefficients of various types of heat spreaders
Developed using our proprietary technology, these special clad metals have low thermal expansivity (compared to Cu) and high heat conductivity (compared to 36Ni-Fe and Fe).
They are also deep-drawable and can be easily press-molded.
And, they can be plated, soldered or directly brazed. These special clad metals are suitable for heat-dispersion substrates and lead frame materials.
[LED mounting boards]
Heat-dispersion materials for LEDs (Cu/36Ni-Fe/Cu, Cu/Fe/Cu, Aℓ striped Cu, etc.)
With their attributes of appropriate heat conductivity and thermal expansivity, these materials have the characteristics needed to meet the growing demand for LEDs with higher intensity and longer lives. Aluminum may be placed on the lightreflecting area to prevent sulfuration.
Copper-Clad, Aluminum for batteries (Ni/Cu, Ni/Cu/Ni, Cu/Aℓ)
These materials have lower electrical resistance than pure nickel, coupled with excellent heat dispersion properties and processability. Due to these characteristics, the materials enable production of various types of larger output and higher capacity batteries.